Research

Structured applied research in verification, test, reliability and AI-driven engineering systems.

SIS conducts research to anticipate structural inflection points in semiconductor engineering — from scalable verification architectures and advanced 3DIC methodologies to memory test, repair strategies, reliability modeling, and AI-augmented engineering systems.

Research Positioning

  • Methodological rigor — formal foundations, reproducibility, standards alignment.
  • Industrial relevance — direct applicability to verification, DFT, test, and reliability.
  • Architectural foresight — anticipating complexity in chiplet and AI-integrated systems.

Focus Areas

Advanced Verification

Scalable and governance-aware methodologies.

  • Chiplet systems
  • Cross-layer coherence
  • Safety formalization

Test & 3DIC

Evolution of test infrastructures.

  • 3DIC test architectures
  • Repair strategies
  • Data-centric analytics

Memory Test

High-density SRAM & NVM technologies.

  • BIST optimization
  • Failure classification
  • Redundancy analysis

Reliability

Predictive lifecycle integrity.

  • Degradation modeling
  • Systemic failure detection
  • Post-silicon feedback

Applied AI

AI-augmented engineering.

  • Anomaly detection
  • Coverage acceleration
  • Decision support

Research Centers & Labs

SIS collaborates with global research centers to align academic innovation with industrial deployment.

  • ▹ Joint research programs and consortium leadership
  • ▹ Doctoral and post-doctoral co-supervision
  • ▹ Technical advisory for funded initiatives

Standards & Publications

Driving the evolution of engineering standards and methodological frameworks.

  • ▹ Participation in IEEE working groups
  • ▹ Technical position papers & peer-reviewed conferences
  • ▹ Executive technical briefings

Research Portfolio — By Domain

Advanced Memory

BIST, repair methodologies, and NVM reliability.

DFT & 3DIC

Heterogeneous integration test strategies.

Verification

Scalable coherence and formal verification.

Reliability

Predictive lifecycle integrity modeling.

Applied AI

AI-assisted engineering innovation.

Research Collaboration & Technical Exchange

Engage SIS for joint research initiatives, conference collaboration, doctoral co-supervision or strategic technical programs.

Contact SIS